AMD Zen 6 CPUs to Use TSMC 2nm Process in 2026

According to a report from Wccftech, AMD's next-generation Zen 6 processors are expected to debut in 2026, built on TSMC's cutting-edge 2nm N2P process. This new architecture is designed to take on Intel's upcoming Nova Lake CPUs, setting up a direct battle in the high-performance computing market by late 2026.

AMD's processor design typically separates compute and input/output functions. The compute chiplets (CCDs) will move to TSMC's 2nm N2P node, while the I/O die (IOD) will be produced using the 3nm N3P process. This hybrid approach continues AMD's strategy of balancing performance gains with cost efficiency.

Compared to Zen 5, which uses 4nm/6nm nodes with 8 cores and 32MB of L3 cache per CCD, Zen 6 takes a big leap. Each CCD will support 12 cores, 24 threads, and up to 48MB of L3 cache. Meanwhile, the IOD will integrate memory controllers, PCIe, USB interfaces, and an onboard GPU, providing smoother performance across workloads.

A major highlight for enthusiasts is platform compatibility. Zen 6 will remain on the AM5 socket, unlike Intel's Nova Lake which requires a new socket. This gives AMD users an upgrade path with lower overall system costs.

Industry analysts note that TSMC's 2nm N2P node is slated for mass production in Q3 2026, suggesting that Zen 6 could officially launch toward the end of that year. With Intel's Nova Lake CPUs arriving around the same timeframe, the PC market is gearing up for one of the most competitive processor battles in recent years.