Apple Secures Majority of TSMC 2nm 2026 Capacity with WMCM

According to a report from MacRumors, TSMC is on track to begin mass production of its cutting-edge 2nm process by the end of this year, marking a major leap in semiconductor technology. Apple, one of TSMC's most important partners, has already secured half of the foundry's 2nm capacity for 2026.

Industry sources reveal that Apple's upcoming iPhone 18 lineup will be powered by the A20 and A20 Pro chips, while the next-generation MacBook Pro will feature the M6 processor, and the new Vision Pro will run on the R2 chip—all built on TSMC's 2nm process. At least two of these chips are expected to adopt TSMC's new Wafer-Level Multi-Chip Module (WMCM) packaging technology, which offers greater flexibility compared to the current Integrated Fan-Out (InFO) packaging used in iPhone SoCs.

Beyond Apple, leading chipmakers such as AMD, Qualcomm, MediaTek, and Broadcom are also set to embrace TSMC's 2nm technology. Notably, MediaTek recently confirmed that its upcoming flagship SoC has successfully completed the tape-out phase on TSMC's 2nm node, signaling fierce competition in next-generation mobile and computing platforms.