TSMC Boosts EUV Efficiency, 6-Year Output Soars 30x

According to Tom's Hardware, TSMC, the world's leading advanced semiconductor foundry, not only leads in cutting-edge process technology but also operates the largest fleet of ASML EUV lithography machines globally. Since 2019, TSMC has leveraged system-level optimizations and in-house developed EUV pellicle materials to boost wafer output by 30 times while cutting energy consumption by 24%.

Starting with the second-generation 7nm mass production in 2019, TSMC was the first to integrate ASML EUV lithography for large-scale production. The company now controls over 42%–56% of the world's EUV machine capacity, with a total of around 200 EUV systems, adding more than 60 units between 2024 and 2025 to support advanced process expansion.

TSMC's core strength lies in its control over equipment and material chains, driving continuous investments in process optimization—ranging from exposure dose adjustments and material improvements to predictive maintenance. These efforts significantly increase daily machine utilization and production efficiency.

Digitimes reports that TSMC is even transforming a 200mm fab to produce its own EUV pellicle materials, achieving performance beyond ASML's original offerings—demonstrating the company's integrated process and materials capabilities. Industry experts note that EUV lithography requires stricter adjustments compared to traditional deep ultraviolet (DUV) processes, with pellicles playing a key role in protecting masks from particle contamination.

With the shift to EUV, traditional organic pellicles can no longer meet the combined needs of high transmittance and stability. Current EUV processes often use "maskless" setups, which require frequent pattern inspections. Any detected defect can increase costs and slow production, making in-house pellicle development crucial. While ASML and other semiconductor companies have pursued EUV pellicle research, high technical barriers have limited mass production.

TSMC's multi-year R&D in EUV pellicles focuses on enhancing production efficiency and reducing costs for sub-7nm processes, and the company is now accelerating these in-house initiatives. Following its recent exit from the GaN market—citing intense competition from low-cost mainland Chinese players—TSMC plans to convert its 6-inch GaN fab into an advanced packaging facility, focusing on CoPoS. Most notably, TSMC's 8-inch fab at Hsinchu is set to produce its self-developed EUV pellicles, reducing dependency on external supply chains and further boosting EUV process yield.

Data shows TSMC's in-house EUV pellicles have quadrupled lifespan, increased single-wafer production efficiency by 4.5 times, and sharply reduced defect rates, reinforcing the foundry's position at the forefront of next-generation semiconductor manufacturing.