Samsung Memory Sales Soar, HBM4 Production in 2026

On October 31, Samsung Electronics announced that it is in close talks with NVIDIA over supplying its next-generation high-bandwidth memory (HBM) chip, HBM4. Samsung plans to launch the new chip next year but has not specified an exact shipping timeline. HBM chips play a critical role in AI chipsets.

Recently, SK Hynix, NVIDIA's main HBM chip partner, revealed plans to ship its latest HBM4 chips in Q4 and expand sales next year. NVIDIA, in a statement about collaborations with Samsung and other Korean firms, described their work on HBM3E and HBM4 chip supply as "key cooperation," without providing further details.

Samsung's slower entry into the AI-driven memory market had previously weighed on its profits, prompting a restructuring of its chip division last year. This quarter, however, strong demand for conventional memory chips helped lift earnings.

This week, Samsung confirmed sales of its current-generation 12-layer HBM3E chips to "all relevant customers," signaling its active role alongside competitors in supplying the latest high-performance HBM solutions. Analysts note that the launch of HBM4 will be a major test of Samsung's ability to reclaim market leadership.

First introduced in 2013, HBM is a DRAM standard that stacks chips vertically, saving space and reducing power consumption, enabling efficient handling of the massive datasets generated by complex AI applications.