SK Hynix Delays HBM4 Expansion to Early 2026

According to recent reports from South Korean media, SK Hynix has postponed its plan to begin equipment procurement for its next-generation 12-layer stacked HBM4 memory expansion, originally scheduled for late November. The company delayed its investment review meeting—initially planned for October—due to public holidays and internal personnel adjustments, pushing the timeline to late November or early December. As a result, the introduction of HBM4 production equipment is now expected to start early next year.

Although SK Hynix and NVIDIA had earlier faced disagreements over pricing and technical specifications for HBM4, both companies have recently finalized their supply agreement, easing previous uncertainties. With market demand now more defined, SK Hynix has accelerated its internal investment planning. However, under SK Group Chairman Chey Tae-won's ongoing focus on operational efficiency and profitability, the actual pace of capital spending remains cautious.

Industry insiders revealed that SK Hynix is currently producing HBM4 for NVIDIA using modified HBM3E production lines with 12-layer stacks. This approach enables a faster response to demand but extends lead times and reduces flexibility. Since official HBM4 production equipment must be installed by early next year, any delay in orders within 2025 could affect production stability. To avoid disruption, SK Hynix aims to begin partial equipment procurement before year-end to ensure smooth ramp-up in the first quarter.

Earlier this year, SK Hynix successfully delivered HBM4 samples using existing equipment and began small-scale production in the first quarter. In September, the company announced that its HBM4 mass production system had been established—signaling that it is currently operating in a transitional phase toward full-scale production.

At the company's Cheongju M15X facility, infrastructure construction continues. While the first cleanroom has already been activated, the installed equipment mainly supports facility operations rather than direct HBM4 processes. Power supply coordination with local authorities is still ongoing, and with typical lead times of one to two months for equipment installation, industry observers expect dedicated HBM4 tools to be operational early next year.

Sources indicate that SK Hynix's investment review committee could convene as soon as late November. Once decisions are finalized, partners will be notified to adjust their delivery schedules accordingly. Despite broader organizational changes within SK Group, SK Hynix is expected to maintain its current structure, leveraging strong profitability from HBM products to advance next-generation investments steadily.

Meanwhile, Samsung Electronics is also ramping up preparations for HBM4 mass production at its Pyeongtaek campus. The company has completed new equipment installations and testing, with yield rates steadily improving. Industry analysts predict that Samsung will begin stable HBM4 shipments next year, intensifying competition with SK Hynix for leadership in HBM4 performance and production speed.