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SK hynix M15X Fab to Start HBM4 Production Early

2025-12-29 11:37:08Mr.Ming
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SK hynix M15X Fab to Start HBM4 Production Early

According to a report from South Korean outlet The Elec, SK hynix is set to bring its new M15X wafer fab online earlier than planned, accelerating its next phase of advanced memory production.

Sources say SK hynix now aims to start producing 1b DRAM at the M15X fab in February 2026, roughly four months ahead of its original June schedule. This 1b DRAM is a critical building block for the company's upcoming HBM4 high-bandwidth memory. Initial monthly output is expected to be around 10,000 wafers, with capacity projected to ramp up to 55,000–60,000 wafers per month by the end of 2026.

SK hynix has already made solid progress on the product side. In September, the company completed HBM4 customer samples and delivered them to NVIDIA for testing. These samples are now in the final tuning phase, which is reportedly going smoothly. NVIDIA is expected to adopt SK hynix's HBM4 for its next-generation Rubin AI accelerators, underscoring the importance of the early production start.

Public information shows SK hynix has invested over 20 trillion won into building the M15X fab. Located near the existing M15 facility, M15X is designed specifically for 1b DRAM, which will serve as the core die for HBM3E and HBM4 products. While earlier figures suggested an initial capacity of about 35,000 wafers per month, long-term expansion targets remain in the 55,000–60,000 wafer range.

Preparation for mass production has been underway since late last year. SK hynix began reserving key equipment early, and some DRAM engineers from its Icheon campus have been reassigned to M15X to support tool installation and production readiness. The new fab also features a larger cleanroom than existing facilities, reflecting the greater space and equipment demands of HBM manufacturing compared with conventional DRAM processes.

Overall, the earlier ramp of M15X highlights how aggressively SK hynix is moving to secure capacity for next-generation HBM, as demand from AI and high-performance computing continues to accelerate.

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