TSMC 2nm Fab Expansion to Complete in 2028

To keep up with surging AI chip demand, TSMC is pressing ahead with another round of 2nm capacity expansion in southern Taiwan. The company's latest environmental review documents show it plans to build a new semiconductor fab in the A Block of the Southern Taiwan Science Park Special Zone, covering about 15.46 hectares. Construction planning, permit applications, and on-site work are scheduled to begin in 2026, with completion and operational approval targeted for 2028.

The move comes as AI workloads continue to drive advanced-node demand. In January, NVIDIA CEO Jensen Huang said the company is facing exceptionally strong demand this year and expects TSMC's overall capacity could more than double over the next decade. That outlook has reinforced market expectations that 2nm capacity will remain tight, especially for high-performance computing and AI accelerators.

TSMC has been accelerating its fab expansion strategy in recent years, and industry sources have linked the new project to efforts to ease pressure on future 2nm orders. According to the latest environmental impact documentation, a public meeting for the "Tainan Science Industrial Park (Special Zone, Development Block A) New Semiconductor Fab Project" is scheduled for February 24. The proposed site is located in Anding District, Tainan, adjacent to Shugu Science Park on the south and the Tainan Park of the Southern Taiwan Science Park on the east.

The newly released environmental report confirms the 15.46-hectare footprint and outlines a clear timeline. If approvals proceed as planned, construction preparation will start in 2026, with plant completion and usage permits expected in 2028. The final schedule will still depend on regulatory reviews and engineering progress, but for the semiconductor supply chain, the message is clear: TSMC is doubling down on 2nm to stay ahead in the AI era.