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$5B Bet: Applied Materials, Micron Build AI Memory

2026-03-11 11:43:23Mr.Ming
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$5B Bet: Applied Materials, Micron Build AI Memory

On Wednesday, Applied Materials announced a new collaboration with memory maker Micron Technology and other industry partners to develop next-generation chips designed for artificial intelligence (AI) and high-performance computing (HPC) systems.

Micron and several other memory companies will join the R&D arm of Applied Materials’ Equipment and Process Innovation and Commercialization (EPIC) Center as founding partners. The companies will work together to accelerate the development and commercialization of advanced memory technologies that support increasingly demanding AI workloads.

The EPIC Center is part of Applied Materials' broader plan to invest up to $5 billion in semiconductor equipment research and development. According to the company, spending will ramp up gradually as collaborative projects with partners begin.

Demand for advanced memory is rising quickly as major technology companies expand their AI infrastructure. Firms such as OpenAI, Google (owned by Alphabet), and Microsoft are rapidly building large-scale AI data centers, driving strong demand for memory chips. As a result, supply has tightened and prices have increased, with global memory makers including Samsung and Micron noting that meeting current market demand remains challenging.

Industry analysts expect large technology companies to invest at least $630 billion in AI infrastructure by 2026, further fueling demand for high-performance memory solutions.

Under the new partnership, Applied Materials and Micron will focus on advancing key memory technologies, including DRAM, high-bandwidth memory (HBM), and NAND flash. The collaboration will combine Applied Materials’ process and equipment expertise at the EPIC Center with Micron's research capabilities at its Boise, Idaho innovation hub.

Additional collaborations with other memory manufacturers will focus on improving materials engineering, process integration, and 3D advanced packaging technologies for next-generation DRAM and HBM devices.

Applied Materials first revealed plans for the EPIC Center in 2023, initially announcing an investment of up to $4 billion. The company expects the research facility to begin operations around 2026, creating a new platform for joint semiconductor innovation across the industry.

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