Samsung and Qualcomm Resume 2nm Talks

According to reports, as Samsung Electronics continues to improve the yield of its 2nm process, its foundry division and Qualcomm have resumed discussions on producing 2nm chips. The two companies are reportedly discussing product specifications, pricing, and process optimization. Industry sources suggest that Qualcomm may consider a dual-foundry strategy involving both Samsung Electronics and TSMC, although the scale of any potential Samsung order remains uncertain.

Samsung and Qualcomm’s relationship cooled after thermal and power-consumption issues affected the Snapdragon 8 Gen 1, which was manufactured using Samsung’s 4nm process. Starting with the Snapdragon 8+ Gen 1, Qualcomm gradually shifted its flagship chip production to TSMC. The latest Snapdragon 8 Elite Gen 5 is also reportedly manufactured by TSMC.

As Samsung’s 2nm yield improves, signs of closer cooperation between the two companies have emerged. Industry estimates indicate that yields for Samsung’s SF2 and SF2P processes have risen from around 20% in the second half of 2025 to approximately 50%–60% currently. According to TrendForce data, TSMC’s 2nm process yield was around 60%–70% as of April this year, compared with approximately 55% for Samsung.

Qualcomm is scheduled to unveil its next-generation flagship application processor, the Snapdragon 8 Elite Gen 6, at the Snapdragon Summit in Hawaii on September 22. A higher-end Pro or Extreme version is also expected to be introduced. Earlier reports suggested that Qualcomm was evaluating a dual-foundry production strategy, partly because of Samsung’s improving 2nm yield and the relatively high wafer prices of TSMC’s 2nm process. However, more recent reports indicate that both chips could still be manufactured entirely by TSMC, leaving Samsung’s potential order uncertain.

Yield and mass-production stability remain the key factors determining whether Samsung can secure Qualcomm’s business. Reports indicate that Qualcomm may require a yield of around 70% for large-scale production, while Samsung’s 2nm yield remains in the range of the mid-50% to slightly above 60%. By comparison, TSMC’s N2 process has reportedly reached a yield of around 70%, while the company plans to improve its N2P process to achieve an approximately 80% mass-production yield within the year.

Samsung may nevertheless have an advantage in terms of available capacity. TSMC plans to increase its 2nm monthly capacity to around 60,000 wafers in the fourth quarter of this year, but Apple is reportedly expected to secure more than half of the initial capacity for its iPhone 18 and M6 chips. Meanwhile, TSMC’s 3nm capacity is reportedly largely booked through 2027 by customers including NVIDIA and AMD, potentially creating additional pressure on Qualcomm’s access to advanced-node capacity.

For Samsung, regaining flagship chip orders from Qualcomm could carry greater symbolic significance than the order volume itself. The key challenge, however, will be demonstrating that its 2nm technology can achieve stable, high-yield, large-scale mass production. Whether Samsung can meet these requirements may ultimately determine whether the renewed discussions with Qualcomm develop into a new production partnership.