Samsung HBM Prices May Rise Over 100% Next Year

According to a report by The Chosun Daily on October 7, Samsung Electronics is planning to significantly raise its HBM prices for 2027 as the market transitions from fifth-generation HBM3E to sixth-generation HBM4. The company’s 2027 supply prices could rise to more than twice the current level, representing an increase of over 100%.

The report identified three major factors behind Samsung Electronics’ planned HBM price increase.

First, strong conventional DRAM prices are creating upward pressure on HBM prices. TrendForce forecasts that contract prices for conventional DRAM will increase by 10% to 15% quarter over quarter in the fourth quarter of 2026, while contract prices for DRAM products including HBM are expected to rise by 15% to 20%. Goldman Sachs noted that stronger revenue from conventional DRAM production is also creating conditions for HBM prices to increase.

Second, higher wafer consumption and advanced process costs are increasing HBM production expenses. HBM dies are relatively large, and the transition to newer generations requires greater wafer consumption. In addition, Samsung’s HBM4 base die uses a 4nm logic process, significantly increasing manufacturing costs. Goldman Sachs expects most new DRAM capacity to be allocated to HBM production, which could constrain conventional DRAM supply and keep prices elevated, creating further support for higher HBM prices.

Third, price increases by Micron are strengthening the market’s upward pricing trend. Micron has recently secured most of its HBM capacity for 2027 at prices higher than those agreed for 2026. The company’s decision to raise prices substantially could give Samsung Electronics and SK Hynix greater room to adjust their HBM pricing in line with market conditions.

KB Securities also forecasts that Samsung Electronics’ HBM selling prices could increase by more than 100% in 2027. Meanwhile, TrendForce expects the global average HBM price to rise by approximately 121% in 2027.

Samsung Electronics began mass production of HBM4 in February 2026, with shipments expected to increase significantly in 2027. The company has already secured a substantial number of orders for 2027 from major customers, including NVIDIA and Broadcom, while price negotiations entered their final stage this month.

Industry analysts said Samsung Electronics could have considerable negotiating leverage as both conventional DRAM and HBM markets remain relatively tight. However, the actual improvement in profitability will depend on several factors, including HBM4 yields, the pace of customer qualification, and wafer allocation strategies.

According to Hana Securities, HBM could account for around 15% of Samsung Electronics’ DRAM revenue in 2027 as HBM4 shipments expand. If HBM prices increase by 100%, the contribution could potentially rise to between 20% and 30%.