Samsung Expands Taylor Plant's 2nm Capacity

According to industry reports, Samsung Electronics plans to add 6,000 wafers per month of 2nm chip production capacity at its semiconductor manufacturing facility in Taylor, Texas. The Taylor site is part of Samsung's broader strategy to expand its chip manufacturing footprint in the United States. Its first facility, Taylor 1, is expected to begin operations by the end of 2026.

Unlike TSMC, which plans to begin mass production of 3nm chips at its Arizona facility by the end of 2027 and introduce 2nm production before 2030, Samsung aims to bring Taylor 1 online by the end of 2026. The facility is expected to use advanced extreme ultraviolet (EUV) lithography equipment to manufacture 2nm semiconductors.

The 2nm process represents one of the most advanced technologies in semiconductor manufacturing. Samsung, TSMC, and Intel are all developing or producing chips using advanced process technologies at this scale, while TSMC remains the global leader in foundry market share.

Samsung and TSMC have adopted different transistor designs for their 2nm process technologies, moving beyond the architectures used in previous generations. Both companies use gate-all-around field-effect transistor (GAAFET) technology. Samsung calls its implementation Multi-Bridge Channel Field-Effect Transistor (MBCFET), which uses nanosheet channels rather than nanowires. The gate surrounds these channels to provide more precise control over current flow, helping improve transistor performance and power efficiency.

Reports indicate that Samsung is preparing to expand 2nm production capacity at its Taylor facility. The company has reportedly placed an equipment order that would enable an additional 6,000 wafers per month of advanced-process manufacturing capacity at the site.

Taylor 1 is expected to begin operations by the end of 2026, with the Taylor campus projected to reach a monthly capacity of 20,000 wafers in the second half of 2027. The latest equipment order builds on Samsung's earlier procurement plans aimed at establishing an initial monthly capacity of 10,000 wafers.

According to sources cited in the reports, the latest investment could bring the Taylor campus's total monthly wafer capacity to 20,000 when Samsung's pilot production capacity is included. The expansion would strengthen Samsung's US semiconductor manufacturing operations and support its efforts to compete in the advanced 2nm chip market.