TSMC Samsung Sells Out 2027 HBM Capacity

According to Samsung Electronics’ third-quarter 2026 earnings call on October 29, the company has fully sold out its 2027 high-bandwidth memory (HBM) production capacity at its targeted price levels. Samsung also expects DRAM supply to remain tight in 2028, reflecting continued demand for advanced memory products.

During the third quarter, Samsung recorded single-digit percentage growth in shipments of both DRAM and NAND flash memory. Average selling prices (ASPs) increased by approximately 20% for DRAM and nearly 10% for NAND. For the fourth quarter, the company forecasts DRAM shipments to increase by 15% to 20%, while NAND shipments are expected to grow by approximately 15%.

In its HBM business, Samsung reported that HBM4 sales revenue increased more than threefold quarter over quarter in the third quarter, accounting for 60% of total HBM revenue. The company has also signed long-term supply agreements (LTAs) with 10 customers, while negotiations for multi-year contracts are ongoing with another 10 customers. Through these agreements, Samsung aims to secure commitments covering 60% to 70% of its total production capacity.

Meanwhile, Samsung’s foundry business plans to increase investment in manufacturing facilities in South Korea and the United States. The company is also considering expanding its wafer fabrication and advanced packaging capacities to support future semiconductor demand.