Samsung
As the memory industry leader for more than two decades, Samsung has continued pioneering milestone DRAM technologies since the early 1980s. Samsung’s leading-edge DRAM solutions are widely used in today’s most up-to-date digital devices, based on the solutions’ industry-leading performance, density and energy-efficiency. Samsung has been providing the industry’s first DRAM solutions based on 10nm-class process and HBM memory for use in applications ranging from High-Performance Computing (HPC), advanced graphics and network systems, next-generation datacenters, enterprise servers and artificial intelligence that deal with data-intensive applications including real-time analytics, high-frequency trading and artificial intelligence.
Samsung has been an innovator in flash memory technologies, offering a host of high-performance, high-density, high-reliability data storage solutions for use in PCs, enterprise storage, mobile devices, branded SSDs and external memory cards.
Since 2013, Samsung’s industry-first 3D V-NAND technology has overcome the challenges posed for former data storage devices and secured optimal performance, density and reliability. In particular, Samsung’s V-NAND SSDs offer unprecedented scalability that will continue to address the ever-increasing needs for data processing and storage systems.
Samsung's Exynos family, a line-up of mobile processors, is designed to power the devices of today across the IT landscape, from premium mobile devices to automotive and IoT applications. Available with the industry’s most advanced process technologies, as well as the latest multi-mode modem and connectivity solutions for 2G to 5G, Samsung’s flagship processors bring outstanding performance and power efficiency to meet a wide range of requirements of today’s smart and connected devices.
Through advanced mobile imaging technologies, Samsung’s ISOCELL image sensors enable DSLR-level photography experiences with excellent color and brightness, fast auto focus and diverse dual-camera solutions on today’s mobile devices. Samsung’s image sensors, when used for automotive applications, also offer safer driving experiences with clearer views and more accurate object detection.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
| K4F2E3S4HM-MFCJ K4F2E3S4HM-MFCJ | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：200FBGA Packaging：Tape |  | |||
| K4F6E3S4HM-TFCL K4F6E3S4HM-TFCL | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：200FBGA Packaging：Tape | | |||
 | KLMCG4JETD-B041 KLMCG4JETD-B041 | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：- Packaging：Box | | |||
| K4B1G0846I-BCNB K4B1G0846I-BCNB | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：78FBGA Packaging：Tape | | |||
| K4B4G1646E-BMMA K4B4G1646E-BMMA | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：96FBGA Packaging：Tape | | |||
| K4ZAF325BM-HC14 180FBGA Pre-ordered Products ROHS | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：180FBGA Packaging：Reel | | |||
| K3QF3F30BM-AGCG K3QF3F30BM-AGCG | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：178FBGA Packaging：Tape | | |||
| K3UH6H60BM-EGCL K3UH6H60BM-EGCL | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：376FBGA Packaging：Tape | | |||
| K3UH7H70AM-JGCR 432FBGA Pre-ordered Products ROHS | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：432FBGA Packaging：Reel | | |||
| K4UBE3D4AM-GHCL K4UBE3D4AM-GHCL | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：200FBGA Packaging：Tape | |
Manufacturers introduction
