Samsung
As the memory industry leader for more than two decades, Samsung has continued pioneering milestone DRAM technologies since the early 1980s. Samsung’s leading-edge DRAM solutions are widely used in today’s most up-to-date digital devices, based on the solutions’ industry-leading performance, density and energy-efficiency. Samsung has been providing the industry’s first DRAM solutions based on 10nm-class process and HBM memory for use in applications ranging from High-Performance Computing (HPC), advanced graphics and network systems, next-generation datacenters, enterprise servers and artificial intelligence that deal with data-intensive applications including real-time analytics, high-frequency trading and artificial intelligence.
Samsung has been an innovator in flash memory technologies, offering a host of high-performance, high-density, high-reliability data storage solutions for use in PCs, enterprise storage, mobile devices, branded SSDs and external memory cards.
Since 2013, Samsung’s industry-first 3D V-NAND technology has overcome the challenges posed for former data storage devices and secured optimal performance, density and reliability. In particular, Samsung’s V-NAND SSDs offer unprecedented scalability that will continue to address the ever-increasing needs for data processing and storage systems.
Samsung's Exynos family, a line-up of mobile processors, is designed to power the devices of today across the IT landscape, from premium mobile devices to automotive and IoT applications. Available with the industry’s most advanced process technologies, as well as the latest multi-mode modem and connectivity solutions for 2G to 5G, Samsung’s flagship processors bring outstanding performance and power efficiency to meet a wide range of requirements of today’s smart and connected devices.
Through advanced mobile imaging technologies, Samsung’s ISOCELL image sensors enable DSLR-level photography experiences with excellent color and brightness, fast auto focus and diverse dual-camera solutions on today’s mobile devices. Samsung’s image sensors, when used for automotive applications, also offer safer driving experiences with clearer views and more accurate object detection.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
| K9F1G08UOC-PCBO TSOP-48 NAND FLASH ROHS | Category：NAND FLASH Manufacturer：SAMSUNG(三星半导体) Package：TSOP-48 Packaging：Reel |  | |||
| KLM8G1GETF-B041 FBGA eMMC ROHS | Category：eMMC Manufacturer：SAMSUNG(三星半导体) Package：FBGA Packaging：Tray | | |||
| KLM4G1FETE-B041 FBGA eMMC ROHS | Category：eMMC Manufacturer：SAMSUNG(三星半导体) Package：FBGA Packaging：Tray | | |||
| KLMAG1JETD-B041 FBGA-153 eMMC ROHS | Category：eMMC Manufacturer：SAMSUNG(三星半导体) Package：FBGA-153 Packaging：Tray | | |||
| KLMBG2JETD-B041 KLMBG2JETD-B041 | Category：eMMC Manufacturer：SAMSUNG(三星半导体) Package：FBGA-153 Packaging：Pallet | | |||
| K4A8G085WB-BIRC 78FBGA Pre-ordered Products ROHS | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：78FBGA Packaging：Reel | | |||
| K4A8G165WC-BCPB 96FBGA Pre-ordered Products ROHS | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：96FBGA Packaging：Reel | | |||
| K4A8G165WC-BCWE K4A8G165WC-BCWE | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：96FBGA Packaging：Tape | | |||
| K4B1G0846I-BYNB 78FBGA Pre-ordered Products ROHS | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：78FBGA Packaging：Reel | | |||
| K4B2G0846F-BCNB K4B2G0846F-BCNB | Category：Pre-ordered Products Manufacturer：SAMSUNG(三星半导体) Package：78FBGA Packaging：Tape | |
Manufacturers introduction
