Winbond Electronics Corporation
Winbond Electronics Corporation was established in September, 1987. The main business groups of Winbond include: DRAM Product, NOR Flash and Memory IC Manufacturing. Winbond headquarters in Central Taiwan Science Park, Taiwan and subsidies in America, Japan, and Hong Kong. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME? Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
 | W631GU6MB11IIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： |  | |||
| W631GU6MB12IIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | | |||
| W631GU6MB12I TRIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | | |||
| W631GU6MB15IIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | | |||
| W631GU6MB15I TRIC DRAM 1GBIT PARALLEL 96VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | | |||
| W631GU8MB11IIC DRAM 1GBIT PARALLEL 78VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | | |||
| W631GU8MB12IIC DRAM 1GBIT PARALLEL 78VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | | |||
| W631GU8MB12I TRIC DRAM 1GBIT PARALLEL 78VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | | |||
| W631GU8MB15IIC DRAM 1GBIT PARALLEL 78VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | | |||
| W631GU8MB15I TRIC DRAM 1GBIT PARALLEL 78VFBGA | Category：Memory Manufacturer：WINBOND(华邦) Package： Packaging： | |
Manufacturers introduction
