XINER
Core to semiconductor technology (shenzhen) co., LTD. (Xiner core semiconductor), founded in 2013, is by the shenzhen hin, state-owned assets supervision and administration commission of shenzhen, shenzhen talents of science and technology innovation fund, wide fortune venture capital, the capital, and xiamen falcon well-known institutions such as joint investment, is committed to high-power IGBT chip, IGBT driver chip, and development, application and sales of intelligent power module.Xineng has an experienced, pragmatic team, the main personnel have more than 10 years of industry accumulation, in the first successful domestic mass production of IGBT products based on FST process.We have r&d centers in Shanghai and shenzhen and sales offices in shenzhen, Shanghai, Qingdao, shunde and hangzhou.
Adhering to the business philosophy of application orientation, focus on research and development, open cooperation, deep mining customer application needs, focus on IGBT related product research and development design, and cooperate with the industry's most excellent partners to provide customers with the most stable cost-effective power devices.
At present, the core can focus on 600V and 1200V small and medium power IGBT products, IGBT single tube, IPM, IGBT module and HVIC four fields have perfect product sequence, product performance leading in China.Products are widely used in industrial inverter, servo driver, inverter home appliances, induction cooker, industrial power supply, inverter welding machine and other fields;For medium and large power products, core power can also provide systematic solutions: 650V/450A and 1200V/450A EconoDUAL intelligent IGBT power module, 34mm module, 62mm module and other products are recognized by the end customers.
Core can be used as the only one to have a combination of high-power IGBT chip, IGBT drive chip and intelligent power module design ability of the company, can not only provide customers complete solutions and professional technical support, but also can according to customer or industry application requirements in terms of depth of customized design, improve the competitiveness of customers products.
We adhere to customer-centric, hope to further with the domestic system application company depth cooperation, together with the breaking of foreign monopoly, the formation of a real fighting force belongs to the domestic system manufacturers!
Model
Images | Mfr.Part # | Category/Manufacturer/Package/Packaging | RoHS | Price | Quantity | Operate |
|---|
| XNF19N60TFieldStop 600V 19A 2V@15V，19A 6.5V@250μA TO-220F IGBTs ROHS | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：TO-220F Packaging：Tube |  | |||
| SP25N135TFieldStop 1350V 25A 2.1V@15V,25A 6.5V@400μA TO-3PN IGBTs ROHS | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：TO-3PN Packaging：Tube | | |||
| XNS25N120T TO-247 IGBTs ROHS | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：TO-247 Packaging：Tube | | |||
| XNL40N120TFieldStop 1200V 40A 2.3V@15V,40A 6.5V@400μA TO-264 IGBTs ROHS | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：TO-264 Packaging：Tube | | |||
| XNS15N120TFieldStop 1200V 15A 2.5V@15V，15A 6.5V@400μA TO-247 IGBTs ROHS | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：TO-247 Packaging：Tube | | |||
| XNS50660AB DIP-23 IGBTs ROHS | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：DIP-23 Packaging：Tube | | |||
| XNM6N60T XNM6N60T | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：TO-252 Packaging：Tape | | |||
| XNS50660ABS XNS50660ABS | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：SOP-23 Packaging：Tube | | |||
| XNS40N120T XNS40N120T | Category：IGBTs Manufacturer：Xiner(芯能半导体) Package：TO-247 Packaging：Tube | | |||
| XNM50550AT DIP-23 MOSFETs ROHS | Category：MOSFETs Manufacturer：Xiner(芯能半导体) Package：DIP-23 Packaging：Tube | |
Manufacturers introduction
