Fighting 3nm, the battle between Samsung and TSMC

Korea Economic Daily reported that Samsung Electronics will use the most advanced 3nm process node to produce chips for customers such as Huida, Qualcomm, IBM and Baidu, which may narrow the gap with TSMC (2330). According to market analysis, TSMC and Samsung will have a high concentration of customers in advanced processes such as 3nm in the future, and the two heroes will compete in terms of yield and technology.

TSMC is scheduled to mass-produce 3nm in Nanke, Taiwan within this year. TSMC President Wei Zhejia mentioned during the technical forum that TSMC’s 3nm “has unspeakable difficulties”, but it is about to mass-produce, and has been thinking for a long time to maintain the fin field effect transistor (FinFET) structure. The process technology is not only good-looking , It sounds good but also practical. Interpreted by the outside world, Wei Zhejia's words secretly choked on the previous big battle to promote the 3-nanometer rival Samsung.

The report quoted people familiar with the matter as saying that Samsung Electronics will use 3nm technology to help Nvidia produce graphics processing unit (GPU) chips, help IBM produce central processing unit (CPU) chips, help Qualcomm produce smart phone application processor chips, and help Baidu produce Artificial intelligence (AI) chips in cloud data centers. These customers are rumored to have chosen Samsung Electronics as the foundry manufacturer, mainly considering Samsung Electronics' 3nm process technology and the need for diversified suppliers.

Market observers believe that Samsung Electronics hopes to overtake TSMC in the foundry field with 3nm technology. Samsung Electronics and TSMC have already entered the fierce 3nm process competition. Samsung Electronics said in June that it has taken the lead in the world and started mass production of 3nm chips, narrowing the gap with TSMC.