According to reports, Samsung Electronics researchers recently stated at the EUV lithography machine ecosystem conference held in the country that by 2026, the global 3nm process node foundry market will reach US$24.2 billion, an increase of US$1.2 billion this year. More than 20 times.
At present, Samsung Electronics is the only company that has announced the successful mass production of 3nm chips. As major semiconductor manufacturers such as Samsung Electronics, TSMC, and Intel begin to introduce EUV equipment, and the process technology continues to develop, it is expected that the 3nm process will become a key competition node.
The researcher cited data from research firm Gartner as saying that by the end of this year, the 5nm and 7nm processes accounted for the largest share in the foundry market, with a market size of US$36.9 billion, and their share will gradually be replaced by 3nm in the future. He also introduced that the 3nm node requires a new device structure to improve performance. Samsung, which was the first to achieve mass production, used MBCFET with a gate-around (GAA) transistor structure, which has significantly improved performance and power consumption compared with FinFET.