Soitec Breaks Ground on Singapore Fab Expansion Project

Recently, French semiconductor materials company Soitec announced the groundbreaking of an expansion project at its wafer plant located in the Singapore-based Brice Li Semiconductor Industrial Park. The expansion aims to enhance the production of 300mm Silicon-On-Insulator (SOI) wafers, which are crucial for manufacturing smartphone chips, especially for 5G communication, as well as components used in automotive and smart devices.

Upon completion in 2024, the expanded facility will double the annual production capacity of Soitec's Singapore plant, reaching approximately 2 million wafers per year. This significant capacity increase is part of Soitec's strategic growth plan to meet the rising global demand for wafers, particularly those critical to cutting-edge technologies in communications and automotive industries.

This expansion complements Soitec's efforts to increase its global wafer production capabilities. The initiative aligns with plans to enhance the capacity at Soitec's French headquarters as well, with the company targeting a global annual production capacity of approximately 4.5 million wafers by the fiscal year 2026.

In addition, Soitec has entered into a new phase of collaboration with STMicroelectronics (ST) for Silicon Carbide (SiC) substrates. The two companies are working together to advance Soitec's SmartSiC™ technology, with STMicroelectronics planning to certify the SiC substrates within the next 18 months. This collaboration will help STMicroelectronics integrate SmartSiC™ technology into their 8-inch substrate manufacturing process to power their devices and modules, with mid-term mass production expected.

The expansion in Singapore and the strategic partnership with STMicroelectronics signal Soitec's continued commitment to innovation and meeting the evolving needs of the semiconductor industry, as demand for advanced materials in high-performance devices continues to grow.