Canon Releases New Semiconductor Lithography Machine for High-Resolution Imaging and Large-Field Exposure

Canon announced on March 13th that it has launched a new semiconductor photolithography product, the i-line stepper photolithography machine "FPA-5550iX", which is designed for the front-end process of semiconductor manufacturing. The product boasts a high resolution of 0.5μm (micrometer) and a large exposure field of 50 x 50mm, making it a versatile option for a variety of manufacturing fields, including electronic components and devices.

The FPA-5550iX has a wide range of applications, including in the production of full-frame CMOS sensors and exposure processes for small display devices such as head-mounted displays. Furthermore, with the increasing demand for advanced XR device displays, the product can also be widely used in the manufacturing of high-contrast, large field-of-view micro-OLED displays.

One of the key features of the FPA-5550iX is its innovative manufacturing method, which simultaneously achieves high resolution and large exposure fields, resulting in a more stable supply of lenses. Another standout feature is its alignment capability, which uses a positioning oscilloscope that can read various alignment marks, enabling the machine to accurately align the photolithography process.

The FPA-5550iX presents an opportunity to offer a cutting-edge product to clients in a range of industries. Its ability to meet the requirements of a diverse range of manufacturing fields, along with its advanced features, makes it an attractive option for clients seeking a versatile and high-quality photolithography machine.