Nvidia, ASML, TSMC, and Synopsys Collaborate to Accelerate Development of Next-Generation Chips and Unveil Breakthrough Technologies

Nvidia, ASML, TSMC, and Synopsys are collaborating to further advance the research and development of next-generation chips, leveraging the semiconductor expertise of Taiwan, the United States, and the Netherlands. This collaboration is significant for the industry as it brings together the world's leading semiconductor design, manufacturing, and equipment experts.

Nvidia is a global leader in graphics chips and dominates the rapidly growing AI high-speed computing market. TSMC is the world's largest wafer foundry, while ASML holds the key lithography technology for advanced process nodes. Synopsys is the world's leading electronic design automation company. This collaboration will bring together the strengths of these companies to create a powerful force in the semiconductor industry.

Nvidia has announced a breakthrough achievement in accelerating computational lithography, which is near the physical limit of chip manufacturing. This technology, called "cuLitho," will help wafer factories increase production and reduce carbon footprint while laying the foundation for the development of 2 nanometer and more advanced processes. This technology will enable chips to adopt more precise transistor and circuit designs, reducing time to market.

TSMC President Wei Jhe-huei pointed out that this development will enable TSMC to deploy reverse lithography technology and deep learning-based lithography solutions on a larger scale, creating new possibilities and providing significant contributions to the continued miniaturization of semiconductors.

In recent years, the semiconductor industry's workload has exceeded Moore's Law due to the increasing number of transistors at newer nodes and the need for greater precision. The required computational time and cost have surpassed the available bandwidth of current platforms, hindering innovation in the industry. "cuLitho" will not only help overcome these obstacles but also assist in developing new solutions and innovative technologies such as curve masks, high numerical aperture extreme ultraviolet lithography, and sub-atomic photoresist modeling for new technology nodes.