Infineon and Taiwanese electronic manufacturing services provider Foxconn Technology Group (also known as Hon Hai Precision Industry Co., Ltd.) have agreed to collaborate in the development of electric vehicles.
The two companies will work together to implement SiC (Silicon Carbide) technology in high-power applications for electric vehicles, such as traction inverters, on-board chargers, and DC-DC converters. Leveraging Infineon's understanding of automotive systems, technical support, and SiC products, along with Foxconn's expertise in electronic design, manufacturing, and system-level integration capabilities, the collaboration aims to develop electric vehicle solutions.
Additionally, the two companies plan to establish a System Application Center in Taiwan, China, to further expand their cooperation. This center will focus on optimizing vehicle applications, including smart cockpit applications, advanced driver-assistance systems, and autonomous driving applications. It will also concentrate on electric vehicle applications, such as battery management systems and traction inverters' development. This partnership covers a wide range of Infineon's automotive products, including sensors, microcontrollers, power semiconductors, high-performance memories for specific applications, human-machine interfaces, and security solutions. The System Application Center is expected to be established within 2023.
Peter Schiefer, President of Infineon's Automotive Division, stated, "The automotive industry is evolving, and as the electric vehicle market rapidly grows along with the demand for greater range and performance, the development of electric vehicles must continue to progress and innovate. Infineon's commitment to innovation and zero-defect quality makes us the best partner for our customers. We look forward to co-writing the new chapter of electric vehicles with Foxconn."
Jun Seki, Chief Electric Vehicle Strategy Officer at Foxconn, said, "We are delighted to collaborate with Infineon and believe that this partnership will bring optimized architecture, product performance, cost competitiveness, and high-level system integration to provide customers with the most competitive automotive solutions."