PLCC Packaging: Market Share, Advantages, Limitations

PLCC (Plastic Leaded Chip Carrier) is a common packaging form in the electronic components industry. It is a chip carrier made of plastic material with a unique lead arrangement. PLCC is widely used for packaging integrated circuits and other electronic components.

Market Share

PLCC packaging holds a considerable market share in the electronic components industry. According to data, the global PLCC market has shown steady growth in recent years. In 2019, the global shipment of PLCC reached approximately 1 billion units, and it is projected to reach around 1.4 billion units by 2025. This growth is attributed to the wide application of PLCC packaging in various fields, including consumer electronics, communication devices, industrial automation, and automotive electronics.

Advantages and Limitations

PLCC packaging offers several advantages, one of which is its good heat dissipation performance. Its design allows better heat dissipation between the chip and the external environment, contributing to component stability and reliability. Additionally, PLCC packaging adopts convenient soldering and installation methods, making the production process more efficient.

However, PLCC packaging also has some limitations. Firstly, due to the limitations of its lead arrangement, PLCC packaging has relatively fewer pins. This may pose challenges in the design of complex circuits. Secondly, as PLCC packaging utilizes plastic material, its heat dissipation performance is slightly inferior compared to metal packaging. For high-power applications or scenarios requiring better heat dissipation, alternative packaging forms may need to be considered.

Popular Modules

Despite these limitations, PLCC packaging is still employed in popular modules. Some common examples include microcontroller modules like the Atmel AVR series (such as ATmega328P) and Microchip PIC series (such as PIC16F877A), as well as memory modules like Flash memory (such as Intel 28F640) and SRAM memory (such as Cypress CY62128). These modules embrace PLCC packaging due to its compact size, high reliability, and excellent performance in miniaturized products.

As electronic products increasingly prioritize slimness, portability, and high integration, PLCC packaging will adapt to this trend by providing higher circuit density and better heat dissipation performance. Additionally, with the emergence of new technologies like the Internet of Things (IoT), artificial intelligence (AI), and autonomous driving, the demand for PLCC packaging will continue to grow.