Samsung Adopts TEL Equipment for Next-Gen NAND

As per South Korean sources, Samsung Electronics is currently integrating cutting-edge Tokyo Electron (TEL) equipment into its NAND production line at the P3 facility. This move reflects Samsung's dedication to enhancing the competitiveness of next-gen NAND flash technology. Noteworthy is the proactive approach across major NAND production bases, undergoing equipment tests to revolutionize the core equipment supply chain in the upcoming year.

Samsung's procurement of TEL equipment is aimed at augmenting the semiconductor etching processes. Diversifying from single-energy etching, TEL's advanced equipment combines two energy sources, elevating etching speed and precision. Already, Samsung has incorporated TEL's novel etching equipment into its P3 NAND production line, embarking on mass production testing.

This strategic equipment integration is poised to impact Samsung's future NAND endeavors, potentially influencing operations at the forthcoming P4 facility – an imminent semiconductor manufacturing hub. Anticipated to launch in 2024, P4, akin to P3, will be a comprehensive wafer fabrication site for storage semiconductor production and foundry services.

Illustrative of this move, the P4 NAND production line's focus will likely be on V9 and V10 – perceived as next-gen NAND flash solutions. Presently, Samsung's flagship NAND products include V7 and V8, with V8's impressive yield debut in Q4 last year. Estimated at 236 layers for V8 and around 280 layers for V9, these advanced flash offerings underline Samsung's commitment to technological progression.

It's pertinent to mention that a considerable portion of Samsung's prevailing NAND line etching equipment is sourced from Lam Research in the United States. The semiconductor sector, prioritizing stability and reliability, is inherently cautious about core supply chain modifications. Nevertheless, the transition in etching equipment suppliers by Samsung can be attributed to a confluence of factors, such as the advantages inherent in TEL's innovative equipment.

Furthermore, this shift could be indicative of Lam Research's equipment falling short in contributing to the development of next-gen NAND. Industry insiders underscore yield challenges in the advanced NAND development process as a potential driver for this transition.

Samsung's rigorous evaluation of TEL's latest equipment underscores its commitment to technological advancement. Sources confirm active preparations at the P3 facility, indicating the significance of this shift in equipping its facilities for upcoming challenges and opportunities in the NAND landscape.