2026: Record High in Global 200mm Wafer Fab Capacity

SEMI, a prominent authority in the electronics industry, has unveiled its latest report offering a comprehensive glimpse into the future of 200mm wafer fabs. The report anticipates a remarkable 14% surge in worldwide semiconductor manufacturing capacities for 200mm wafers, spanning the period from 2023 to 2026. This expansion will involve the establishment of 12 new 200mm wafer fabs, marking a historic pinnacle with a monthly production capacity exceeding 7.7 million wafers. It is essential to note that this figure excludes EPI.

This impressive growth is chiefly attributed to the automotive and power semiconductor sectors, both poised for a substantial 34% capacity augmentation. In terms of semiconductor specialization, Microprocessor Units/Microcontroller Units (MPU/MCU) take the second spot with a capacity increase of 21%, while MEMS, Analog, and Foundry closely follow at 16%, 8%, and 8%, respectively.

SEMI underscores the pivotal role played by power compound semiconductors in crucial consumer, automotive, and industrial applications, making them the driving force behind investments in 200mm wafer fabs. Notably, the development of powertrain inverters for electric vehicles and the expansion of charging station infrastructure are projected to be significant catalysts for the continued growth of global 200mm wafer fab capacities, in tandem with the rising adoption of electric vehicles.

Ajit Manocha, President and CEO of SEMI, exudes optimism regarding the record-breaking 200mm wafer fab capacity in the global semiconductor industry. This development underscores a positive outlook for the automotive market. Although semiconductor chip supply for automobiles has stabilized, the escalating chip content in electric vehicles and efforts to reduce charging times are stimulating a pronounced expansion in manufacturing capacity.

Prominent chip suppliers, including Bosch, Fuji Electric, Infineon, Mitsubishi, Onsemi, Rohm, STMicroelectronics, and Wolfspeed, are rapidly advancing their projects aimed at bolstering 200mm capacity to meet the ever-growing demand.

The majority of 200mm wafer fab capacity is concentrated within the 80nm to 350nm technology nodes. Projections indicate a 10% capacity growth for nodes ranging from 80nm to 130nm, while nodes from 131nm to 350nm are expected to witness an 18% capacity surge from 2023 to 2026.

Southeast Asia is poised to lead the expansion of 200mm wafer fab capacity, with an impressive projected growth rate of 32% during the reporting period. Mainland China is anticipated to follow closely as the second-largest contributor, with an expected growth rate of 22%. As the foremost contributor to 200mm capacity expansion, Mainland China is on track to achieve a monthly production capacity of over 1.7 million wafers by 2026. The Americas, Europe, the Middle East, and the Taiwan region of China are also anticipated to experience notable growth rates of 14%, 11%, and 7%, respectively.

In the year 2023, Mainland China is projected to occupy a substantial 22% share of the 200mm wafer fab capacity, with Japan following at 16%. Taiwan, Europe, the Middle East, and the United States are expected to contribute 15%, 14%, and 14% to the total capacity, respectively.

SEMI's comprehensive report signifies the potential 20% growth in global 200mm wafer fab capacity, driven by semiconductor manufacturers worldwide establishing 13 new production lines. This significant capacity expansion is set to raise the industry's capacity to an all-time high, exceeding 7 million wafers per month. The surge in demand for automotive and other applications is the driving force behind the expansion in power semiconductors and MEMS. Prominent chip manufacturers, including ASMC, BYD Semiconductor, CR Microelectronics, Fuji Electric, Infineon Technologies, ON Semiconductor, and STMicroelectronics, have all made announcements regarding new 200mm wafer fabs to meet the ever-increasing demand. According to the report, the period from 2021 to 2025 is expected to witness a 58% growth rate in capacity for automotive and power semiconductors, followed by MEMS at 21%, foundry at 20%, and analog at 14%.