Amkor's $1.6 Billion Investment in Vietnam

On October 11th, Amkor, the world's second-largest provider of advanced semiconductor packaging and testing (OSAT) services, made a significant announcement: the official inauguration of their cutting-edge chip manufacturing facility in Yen Phong 2C Industrial Park, located in North Vinh Phuc Province, Vietnam.

Amkor's newly-established plant in Vietnam is set to become their flagship manufacturing site, occupying an impressive 57-acre expanse. The company plans to invest up to $1.6 billion by 2035 in this facility, primarily focusing on the production of advanced System-in-Package (SiP) solutions and comprehensive testing services to meet the ever-growing demands of the semiconductor industry. However, specific details regarding the factory's production capacity and testing capabilities remain undisclosed at this time.

Giel Rutten, President and CEO of Amkor, emphasized the strategic importance of this advanced packaging facility in Vietnam. He highlighted its role in supporting both the global and regional supply chains, especially in critical industries such as telecommunications, automotive, and high-performance computing. Rutten attributed the success of this expansion to the vast and skilled labor force in Vietnam, its strategically advantageous geographic location, and the invaluable support from government entities, making it the ideal platform for Amkor's ongoing growth.

At present, Amkor is headquartered in Tempe, Arizona, USA, with a global presence in terms of research and development centers, along with operational offices in Asia, Europe, and the United States. The company maintains packaging and testing facilities in various countries, including China, South Korea, Japan, Malaysia, the Philippines, and Portugal.

Amkor's diverse product portfolio encompasses a wide array of packaging solutions, encompassing Lead Frame, Ball Grid Array (BGA), Chip Scale Package, and Wafer Level Package options. Additionally, they provide specialized packaging services for MEMS and sensors, as well as Bumping services. These offerings are finely tuned to cater to the unique requirements of industries such as telecommunications, automotive, industrial, computing, and consumer electronics.