Dimensity 8300: 60% GPU Boost, Large Model Pioneer

On November 21st, MediaTek unveiled the Dimensity 8300, a cutting-edge 5G AI mobile chip, ushering flagship-level experiences into the Dimensity 8000 series and enhancing high-end smartphones with advanced AI innovation. As the latest addition to the Dimensity 8000 series, the Dimensity 8300 features state-of-the-art generative AI technology, exceptional energy efficiency, impressive gaming performance, and robust high-speed network connectivity.

Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit, emphasized, "The Dimensity 8000 series is dedicated to expanding flagship user experiences to a wider audience. The Dimensity 8300 showcases highly efficient on-device AI capabilities, supports top-tier storage solutions, and delivers outstanding gaming, imaging, and multimedia entertainment experiences. This marks a comprehensive platform innovation, creating new opportunities in the high-end smartphone market."

Constructed on TSMC's second-generation 4nm process and based on the Armv9 CPU architecture, the Dimensity 8300 houses an eight-core CPU comprising 4 Cortex-A715 performance cores and 4 Cortex-A510 efficiency cores. The CPU achieves a 20% increase in peak performance and a 30% reduction in power consumption compared to its predecessor. Additionally, the Dimensity 8300 integrates a 6-core Mali-G615 GPU, offering a 60% increase in peak performance and a 55% reduction in power consumption. With support for superior memory and storage specifications, the Dimensity 8300 ensures a seamless and fluid user experience across gaming, daily applications, imaging, and more.

Pioneering the market, the Dimensity 8300 is the first in its class to support generative AI, handling up to 100 billion parameter AI language models. The chip incorporates the MediaTek AI processor APU 780, equipped with a generative AI engine that doubles the performance of integer and floating-point operations compared to the previous generation. Featuring support for Transformer operator acceleration and mixed-precision INT4 quantization technology, the AI's overall performance is 3.3 times that of the previous generation, enabling seamless operation of innovative applications utilizing on-device generative AI.

Featuring MediaTek's innovative "StarSpeed Engine," the Dimensity 8300 optimizes resource allocation in real-time based on application performance demands and device temperature information. This guarantees users a high frame rate, stable performance, low power consumption, and extended battery life in gaming experiences. The StarSpeed Engine not only collaborates extensively with gaming applications but also expands ecosystem cooperation for various application types, enhancing users' overall app usage experience.

Additional standout features of the MediaTek Dimensity 8300 include:

· Support for flagship LPDDR5X 8533Mbps memory and UFS 4.0 flash storage with Multi-Circular Queue (MCQ) technology, improving memory transfer rates by 33% and flash storage read/write speeds by 100% compared to the previous generation.

· Integration of the 14-bit HDR-ISP Imagiq 980 image processor, enhancing terminal computing photography performance and upgrading the experience of photography and video recording.

· Integration of the 3GPP R16 5G modem, providing a faster and more stable 5G network experience. The Dimensity 8300 optimizes for specific scenarios, ensuring smoother 5G connectivity in weak signal environments and enhancing Sub-6GHz network connectivity performance and range with support for 3-carrier aggregation, achieving a theoretical peak downlink rate of 5.17Gbps.

· Support for MediaTek 5G UltraSave 3.0+ power-saving technology, reducing 5G communication power consumption by up to 20%, ensuring prolonged 5G battery life.

· Enhanced Wi-Fi 6E performance, supporting 160MHz bandwidth. It also supports Wi-Fi Bluetooth Super Connection technology, reducing latency when smartphones simultaneously connect to Bluetooth headphones, wireless controllers, and other peripherals.

· Support for the Dimensity open architecture, bringing a more personalized and differentiated user experience to terminal devices, unlocking the full potential of the chip.