TSMC Considers 3nm Chip Production in Japan Expansion
In recent developments, TSMC, a leading semiconductor foundry, is actively exploring the establishment of its third wafer fabrication facility in Japan, potentially dedicated to advancing semiconductor technology with the production of 3nm chips. This strategic move has significant implications for positioning Japan as a global center for cutting-edge semiconductor manufacturing.
TSMC, the favored wafer foundry for industry giants NVIDIA and Apple, has communicated to its supply chain partners the potential construction of a new facility in the southern region of Kumamoto, Japan, under the project name "TSMC Fab-23 Phase 3."
The ongoing construction of TSMC's initial wafer fabrication plant in Kumamoto, scheduled for production initiation in 2024, focuses on advanced processes such as 22/28nm and 12/16nm. This project, supported by Japanese authorities, SONY Semiconductor Solutions, Denso, and other key partners, boasts a total investment of $8.6 billion, with approximately 40% subsidized by the Japanese Ministry of Economy, Trade and Industry as of June 2022.
While TSMC has yet to officially confirm plans for a second wafer fabrication plant in Japan, unofficial reports suggest that this facility, also situated in Kumamoto, will advance process technology to a more sophisticated 7nm. The Japanese government has signaled its support through a substantial subsidy of up to 9 trillion yen for TSMC's second Kumamoto plant.
The prospect of a third wafer fabrication plant in Japan, specifically targeting the production of state-of-the-art 3nm processes, remains unconfirmed and awaits official validation from TSMC or Japanese authorities.
In a recent statement, TSMC underscored its commitment to strategic investments in key locations to meet evolving customer demands. Presently, the company is diligently evaluating the feasibility of constructing the second wafer fabrication plant in Japan, with no additional information available for dissemination at this time.
