SK Hynix HBM4: Innovative 3D Stacking on Logic Chips

On November 22nd, according to a report by Joongang.co.kr, SK Hynix, a prominent South Korean memory chip manufacturer, is collaborating with NVIDIA to develop a pioneering GPU. This collaborative initiative involves stacking the next-generation High Bandwidth Memory (HBM4) with logic chips, representing a notable industry milestone. SK Hynix has engaged in partnerships with semiconductor companies, such as TSMC, for advanced packaging technology, with TSMC being the selected manufacturing facility for this groundbreaking project.

SK Hynix is actively recruiting designers for logic chips, including CPUs and GPUs. The objective is to implement a 3D configuration of the future HBM4 on logic chips from industry leaders like NVIDIA and AMD. The HBM4 memory stack is anticipated to feature a 2048-bit interface. Departing from conventional HBM setups, where memory is adjacent to the GPU with an interposer layer, SK Hynix aims to eliminate the interposer layer, achieving direct integration of HBM4 onto the logic chip through 3D stacking.

This cutting-edge technology offers numerous advantages, including a reduction in package size, enhanced capacity, and improved performance. However, effective heat dissipation remains a key challenge. For instance, AMD CPUs employing V-Cache must manage thermal considerations by lowering TDP and frequencies. Data center GPUs, such as NVIDIA's H100, with substantial HBM requirements, face capacity and heat challenges in comparison to V-Cache. The power consumption of a computing center card could be several hundred watts, and managing the heat, particularly from the HBM component, may necessitate sophisticated solutions.

Additionally, opting for this integrated approach will necessitate alterations to chip design and manufacturing methods. Memory and logic chips will share the same process technology and be manufactured in the same wafer fabrication facility, ensuring optimal performance.

SK Hynix is in discussions with chip design companies, including NVIDIA, regarding HBM4 integrated design solutions. Collaborative efforts with NVIDIA may have commenced from the project's inception, with TSMC likely being the selected production facility. The utilization of wafer bonding technology will enable the stacking of SK Hynix's HBM4 onto the logic chip.

The burgeoning demand for generative artificial intelligence is projected to drive the need for HBM storage chips at a growth rate exceeding 40% annually. SK Hynix currently leads the market in HBM products, commanding a substantial market share and serving as a significant supplier of graphics memory for NVIDIA's data center GPUs.