MediaTek Launches Filogic 860 & 360: Wi-Fi 7 Expansion

On November 23, 2023, MediaTek announced the release of its cutting-edge Filogic 860 and Filogic 360 Wi-Fi 7 wireless connectivity solutions, marking a significant stride in meeting the escalating demands of the expanding Wi-Fi 7 market. As a frontrunner in Wi-Fi 7 technology adoption, MediaTek continues to elevate its product suite with advanced network connection technology, exceptional transmission performance, and unmatched reliability.

The Filogic 860 platform seamlessly integrates dual-band Wi-Fi access points with sophisticated network processor solutions, presenting an optimal choice for diverse applications such as enterprise access points, service providers, Ethernet gateways, Mesh nodes, and retail and IoT router scenarios. Meanwhile, the Filogic 360 stands out as an independent single-chip solution, combining Wi-Fi 7 2×2 MIMO with dual Bluetooth 5.4, delivering superior Wi-Fi 7 connectivity for edge devices, streaming devices, and an extensive array of consumer electronics products.

Xu Haojun, Vice General Manager and General Manager of the Intelligent Connection Business Unit at MediaTek, remarked, "MediaTek's comprehensive Wi-Fi 7 wireless connectivity product portfolio distinguishes itself in the market. The Filogic 860 and Filogic 360 inherit the advanced connectivity technologies of the Filogic series, offering high-speed and low-latency features while ensuring excellent reliability and expansive network coverage."

Catering to both enterprise and retail markets, the Filogic 860 provides a holistic dual-band Wi-Fi 7 access point, router, and Mesh node solution. Featuring a three-core Arm Cortex-A73 CPU, robust hardware acceleration support, and advanced network tunneling technology, the Filogic 860 is designed to fully address the requirements of enterprises and service providers.

Key features of the Filogic 860 platform include:

· Advanced high-efficiency 6nm process design

· Support for Single-MAC MLO

· Compatibility with 4096-QAM and MRU

· Dual-band Wi-Fi 7 support, with dual-band MLO rates reaching up to 7.2Gbps

· Dual-band dual-concurrent functionality, 2.4GHz 4T4R up to BW40; 5GHz 5T5R 4SS up to BW160

· Additional receive antenna support for Zero-Wait DFS

· Integration of Filogic Xtra Range technology, enhancing signal coverage with an additional antenna

· The Filogic 360, as an independent single-chip solution, integrates Wi-Fi 7 2×2 MIMO and dual Bluetooth 5.4, delivering an exceptional wireless connectivity experience for high-performance terminals such as smartphones, personal computers, laptops, set-top boxes, and OTT streaming devices.

Key features of the Filogic 360 include:

· Optional Wi-Fi 7 2×2 MIMO in three frequency bands, offering speeds of up to 2.9Gbps

· Support for 4096-QAM and MRU

· Compatibility with 160MHz bandwidth

· Filogic Xtra Range support, featuring a unique Hybrid MLO solution to extend communication distance

· Bluetooth 5.4 support to enhance gaming and other application experiences

· Integration of a DSP supporting the LC3 codec, with support for Bluetooth LE Audio

· Incorporation of MediaTek Wi-Fi Bluetooth coexistence anti-interference technology, ensuring a seamless connection experience

MediaTek anticipates the mass production of its Filogic 860 and Filogic 360 wireless connectivity solutions in the middle of 2024.