Intel's Post-18A Process Plan Revealed in February

On January 4, 2024, Intel unveiled the progress of its IDM 2.0 strategy, outlining plans to introduce five advanced process nodes within four years since its initial announcement in 2021. Leading this initiative is the Intel 18A process, slated for mass production in the latter half of 2024, with anticipated product launches in early 2025.

As reported by Tom's Hardware, Intel will present the roadmap for its evolving process development beyond Intel 18A at the IFS Direct Connect event on February 21, 2024. The keynote address will be delivered by Intel CEO Pat Gelsinger, where insights into the company's future plans are expected to be unveiled.

Intel's previously disclosed information highlights that the Intel 20A process technology will incorporate cutting-edge features such as RibbonFET transistor architecture and PowerVia backside power delivery technology (BSPDN). The more advanced Intel 18A is poised to build upon and enhance these technologies.

During the recent IEDM event, Intel provided valuable insights into the ongoing development of BSPDN, indicating that future advanced process technologies following Intel 18A will also integrate this feature. The RibbonFET transistor architecture is projected to undergo continuous advancements, showcasing Intel's dedication to innovation in this field.

Recognizing the diverse requirements of chips across various applications, Intel has initiated specialized research on different process technologies. For example, the Intel 3 process technology, tailored to meet the needs of data center processors, offers denser and more efficient assembly for high-performance applications with larger current demands. The adoption of similar strategies in future innovations by Intel remains uncertain at this juncture.