Samsung Exynos 2400: Advanced FOWLP for Heat Efficiency

The Exynos 2400, integrated into the Galaxy S24 series, has successfully entered mass production, showcasing innovative technologies. Notably, Samsung's cutting-edge 4LPP+ process has been employed, enhancing production efficiency and energy conservation. A noteworthy milestone for the Exynos 2400 is its status as Samsung's premier smartphone System on Chip (SoC) to embrace Fan-Out Wafer-Level Packaging (FOWLP).

FOWLP packaging technology empowers the Exynos 2400 with increased I/O connections, facilitating swift electrical signal transmission. Furthermore, the compact packaging size significantly enhances heat dissipation, ensuring prolonged smartphone operation without encountering overheating issues. Samsung asserts that the integration of FOWLP technology contributes to a remarkable 23% improvement in heat dissipation, thereby elevating multi-core performance by 8%.

The Exynos 2400's exceptional performance in the recent 3DMark Wild Life stress test can be attributed to the implementation of FOWLP technology. Not only does the SoC chip surpass its predecessor, the Exynos 2200, by twofold, but it also competes favorably with Apple's A17 Pro. Importantly, all models within the Samsung Galaxy S24 lineup are equipped with advanced cooling solutions to ensure optimal operating temperatures.

With Samsung's adoption of FOWLP technology in the Exynos 2400, speculation arises regarding the potential incorporation of this technology in Google's Tensor G4. Rumors suggest that Google's upcoming Pixel 9 and Pixel 9 Pro, expected later this year, will feature the Tensor G4 chip. Given the thermal challenges experienced with Tensor G3, the advanced packaging method in Tensor G4 is anticipated to contribute significantly to temperature control. Furthermore, reports indicate an ongoing collaboration between Google and Samsung for manufacturing purposes.