Samsung Mass Produces AI PC Semiconductor Substrates
Samsung Electro-Mechanics is strategically expanding its footprint in the thriving artificial intelligence (AI) market. Following the successful mass production of cutting-edge semiconductor packaging substrates for AI PCs, the company is poised to introduce flip-chip ball grid array (FC-BGA) technology for AI servers in the latter half of this year.
Industry insiders reveal that Samsung Electro-Mechanics has recently commenced large-scale production of semiconductor packaging substrates tailored for AI PCs. These substrates are in high demand and are being supplied to leading semiconductor companies primarily in North America. Notably, Samsung Electro-Mechanics has not only met but also exceeded its initial production targets, garnering positive feedback from discerning customers.
The newly mass-produced AI PC substrates boast a remarkable increase in size by over 30%, accompanied by a substantial reduction in circuit line width exceeding 30%. This enhancement is particularly significant for AI devices like AI PCs, which demand high-performance chips capable of handling intensive computations. By optimizing size and circuitry, Samsung Electro-Mechanics has elevated the performance of its latest product to meet the rigorous demands of AI devices.
Looking ahead, Samsung Electro-Mechanics plans to broaden the application of AI substrates beyond PCs to encompass smartphones and servers. The company aims to introduce AI server products in the latter half of this year, with a specific focus on commencing mass production of FC-BGA technology. In line with this strategic vision, Samsung Electro-Mechanics announced a significant investment plan totaling 19 trillion won for FC-BGA technology in 2021 and has since been diligently expanding its production capabilities.
Through these concerted efforts, Samsung Electro-Mechanics is poised to significantly enhance its presence and market share in the burgeoning field of artificial intelligence, driving innovation and advancing technological frontiers.
