Samsung HBM3E Fails NVIDIA Validation Linked to TSMC

Samsung Electronics is currently engaged in the validation process of its HBM3E chips, aimed at supplying NVIDIA. However, progress has been hindered due to compatibility issues with TSMC's standards, resulting in ongoing validation efforts for Samsung's 8-layer HBM3E chips. Recent collaborative testing with NVIDIA has been conducted, with further validation notifications received.

Industry experts highlight concerns regarding Samsung's HBM, primarily attributed to TSMC's utilization of SK Hynix's standards during the validation of Samsung's 8-layer HBM3E. Divergence in production methods between SK Hynix and Samsung has led to challenges in validation.

Anticipated adjustments in the validation process for 8-layer HBM3E chips are expected to facilitate seamless supply to NVIDIA. Samsung refutes claims of product defects, emphasizing its commitment to delivering high-quality products.

Samsung's 8-layer HBM3E production line is operating at full capacity for the year 2024, with demand exceeding availability. Concurrently, Samsung is actively conducting customer validation for 12-layer products.

Reports suggest Samsung's deployment of a dedicated team to enhance the yield of 12-layer HBM3E, aiming to pass NVIDIA's quality certification by May.

Expectations are set for the disclosure of NVIDIA's quality test results for products from both Korean companies within 1-2 months. Speculation surrounds NVIDIA's substantial orders for 12-layer HBM3E, prompting industry interest in the allocation of orders between the parties involved.