AMD Unveils MI325X AI Chip: 30% Faster Than NVIDIA H200

On June 3rd, during her keynote at the COMPUTEX Taipei International Computer Show, AMD Chair and CEO Dr. Lisa Su announced the launch of the company's latest AI chip, the Instinct MI325X, which is scheduled to hit the market in the fourth quarter of 2024.

AMD's newly revealed cloud AI accelerator chip roadmap outlines the release of the Instinct MI325X this year, followed by the MI350 in 2025, and the MI400 in 2026.

Dr. Lisa Su emphasized the rapid progress of the previously launched MI300, noting that the next-generation MI325X integrates HBM3E high-bandwidth memory and leverages the CDNA3 architecture. The MI325X boasts up to 288GB of HBM3E memory, delivering 6TB per second of bandwidth. Compared to NVIDIA's H200, the MI325X nearly doubles the memory capacity and bandwidth, with a 30% increase in processing speed.

In addition, AMD plans to introduce the MI350 series in 2025, featuring a 3nm process, and the MI400 series in 2026, based on AMD's CDNA "Next" architecture.

Addressing rumors about the adoption of Samsung's 3nm process, Dr. Lisa Su clarified that TSMC remains a robust partner for AMD, with several collaborative projects involving 3nm process technology currently underway.

Regarding the potential establishment of a research and development center in Taiwan, Dr. Lisa Su highlighted Taiwan's significance to AMD, noting the presence of over a thousand employees in the region. However, no specific plans for a dedicated R&D center have been announced at this time.