ASML is set to deliver its latest High-NA EUV lithography machines to key customers TSMC, Intel, and Samsung by the end of 2024. This announcement underscores ASML's commitment to advancing semiconductor technology and supporting the needs of its major clients.
Roger Dassen, CFO of ASML, confirmed during a recent conference call with analysts that TSMC, Intel, and Samsung will receive the High-NA EUV machines this year. Intel has already placed an order for the cutting-edge High-NA EUV system, which is scheduled for delivery to their Oregon facility by December. However, the timeline for TSMC's receipt of this advanced equipment has not yet been disclosed. A TSMC representative mentioned that the company is working closely with ASML but declined to provide additional details.
ASML’s new High-NA EUV machine is capable of printing semiconductor lines as thin as 8nm, representing a 1.7x reduction compared to previous models. This significant advancement makes it particularly suitable for manufacturing chips used in AI applications and advanced consumer electronics.
The High-NA EUV system is priced at €350 million (approximately $380 million) and weighs as much as two Airbus A320 planes. Despite its high cost, Kevin Zhang, TSMC’s Senior Vice President of Business Development, noted at a recent event in Amsterdam that the company's A16 node technology, set to launch by the end of 2026, will not require the High-NA EUV and can rely on existing EUV lithography machines.
Despite this, TSMC has been actively involved in ASML’s High-NA EUV program. Jefferies analysts, including Janardan Menon, predict that TSMC will utilize the High-NA EUV in its A14 node by 2028. Following discussions with Dassen, analysts believe ASML’s 2025 revenue will likely be at the higher end of the forecast range.
Jefferies analysts also project that ASML’s average orders for the remaining three quarters of this year will be around €5.7 billion each, potentially driving the company’s 2025 sales to €40 billion.