Infineon Technologies has successfully completed the first phase of its 200mm silicon carbide (SiC) power wafer manufacturing facility in Kulim, Malaysia, as reported by various media outlets. The company plans to officially commence operations at the Kulim Module Three plant in August, with SiC production slated to begin by the end of 2024. This facility plays a crucial role in the Malaysian government's ambitious $100 billion plan to enhance the country's semiconductor production capabilities.
In August of last year, Infineon unveiled its plans to establish the world’s largest 200mm SiC power wafer plant in Kulim. The project has received substantial backing from customers, including €5 billion in orders from the automotive and industrial sectors, along with approximately €1 billion in advance payments.
Infineon has committed to investing an additional €5 billion over the next five years for the second phase of construction at Module Three in Kulim. By the end of 2030, this investment, along with planned 200mm SiC upgrades at the Villach and Kulim facilities, is expected to boost annual SiC revenue to around €7 billion.
The silicon carbide market is currently experiencing significant growth, particularly in high-power density and efficiency-critical applications such as automotive and renewable energy sectors. TrendForce projects that the global demand for silicon carbide will continue to rise, with the SiC power device market expected to reach $9.17 billion by 2028.