TSMC Acquires Facility for NT$6.68 Billion

TSMC, the global leader in wafer foundry, announced on July 1st that it has signed a contract with Taiwan-based Resonac to acquire a facility and its associated assets located in Baoshan Township, Hsinchu County. The acquisition, valued at NT$668 million, is aimed at expanding TSMC's office space.

The newly acquired facility, covering approximately 9,247 square meters, is strategically located in the Hsinchu Science Park, adjacent to several existing TSMC sites. This prime location offers seamless integration with TSMC's current operations.

Resonac Corporation, a prominent manufacturer of sputtering thin-film hard disk drives, announced in October 2023 the closure of its Hsinchu plant and the sale of its facilities. The Hsinchu property, spanning about 42,975 square meters, attracted significant interest. Earlier this year, Sigurd UTC Corp. (SGUT) purchased another Resonac facility in the same area for NT$1.68 billion.

In addition to the Hsinchu City plant, Resonac auctioned off land and facilities for a hard disk substrate factory in Baoshan Township. This includes a four-story tech building with a total area of 7,585 square meters of land, which TSMC successfully acquired.

Industry experts see this acquisition as a strategic move by TSMC to support its future business growth and talent expansion. With the global demand for semiconductors continuously rising, TSMC has been proactively increasing its capacity and investing in research and development. The expanded office space will facilitate the company’s ongoing growth and innovation.

As the semiconductor industry evolves amid technological advancements and the AI revolution, TSMC is positioning itself to lead the next wave of industrial progress. The company recognizes AI's potential to drive significant industrial change, setting the stage for continued advancements in semiconductor technology.