Samsung to Mass Produce HBM4 Chip in 4nm

Samsung Electronics announces plans to commence mass production of its next-generation HBM chip, HBM4, utilizing its advanced 4nm manufacturing process. This cutting-edge chip is crucial for powering AI devices, positioning Samsung against major competitors like SK hynix and TSMC in this sector.

Industry insiders reveal that Samsung will leverage its 4nm process to fabricate logic chips for the sixth generation HBM4. These logic chips, essential components at the base of the chip stack, control the DRAM in HBM chips.

While manufacturers have already produced logic chips for existing products like HBM3E, the sixth generation necessitates advanced manufacturing processes to integrate custom functionalities tailored to customer needs.

Samsung's 4nm process boasts a high yield exceeding 70%, successfully applied in products like the Exynos 2400 chip, a key driver in their flagship AI smartphone series, the Galaxy S24.

According to industry experts, despite the higher costs compared to 7nm and 8nm processes, Samsung's 4nm process offers superior chip performance and lower power consumption. Initially targeting 7nm or 8nm processes for HBM4 logic chips, Samsung has shifted its focus to 4nm for enhanced capabilities.

Samsung aims to compete in the rapidly growing AI chip market alongside SK hynix and TSMC, leveraging its strengths in storage and manufacturing to challenge industry dynamics.

The adoption of the 4nm process since 2023 necessitates advanced technologies and double the resources compared to older processes but enables production of high-performance, low-power chips. Samsung's objective is to develop HBM4 chips with high-performance logic to surpass competitors.

Customers such as NVIDIA and AMD have already requested suppliers to develop HBM chips capable of efficiently processing large volumes of data with low power consumption, crucial for AI accelerators designed for tasks like neural networks.

Samsung anticipates that its 4nm manufacturing process will advance HBM chip production, aiming to lead the industry. The company plans to optimize HBM4 chip performance from the logic chip design phase through its LSI department's wafer factory system.

"Our unique advantage lies in involving chip designers in HBM4 production," commented a Samsung executive. Industry sources indicate that Samsung has deployed LSI department personnel to its recently established HBM development team.

TSMC, among others, has responded to Samsung's plans by expanding beyond their planned 12nm process to include 5nm for manufacturing HBM4 logic chips. Both companies are also enhancing their talent pools, hiring experienced logic design engineers to improve HBM4 performance.