TSMC's 3nm Output to Hit 125K Wafers, Priced at $21K

According to industry insiders, TSMC plans to increase its monthly production of 3nm chips from 100,000 to 125,000 wafers in the second half of this year to meet the demand from key clients like Apple, Intel, Qualcomm, and MediaTek.

Sources within semiconductor equipment companies report that TSMC's 5nm and 3nm production capacities are currently at full utilization, with 3nm capacity experiencing particularly high demand.

Furthermore, TSMC's 2nm wafer fabs located in Hsinchu Science Park and Kaohsiung, Taiwan, are making significant progress toward mass production. The company aims to begin mass production of 2nm process technology in the fourth quarter of 2025, targeting a monthly capacity of 30,000 wafers.

Industry experts estimate that with the operational launch of the Kaohsiung plant, TSMC's 2nm wafer production capacity could reach 120,000 to 130,000 wafers per month. The introduction of N2 technology is expected to increase TSMC's highest foundry quotes from $19,000-$21,000 per 3nm wafer to $25,000-$26,000 per 2nm wafer.

In response to ongoing geopolitical concerns and global political-economic uncertainties, TSMC has implemented measures to strengthen cost and profit control. These measures include leveraging its competitive edge to increase foundry quotes while reducing equipment procurement costs.

Additionally, TSMC plans to introduce a back-side power rail solution for high-performance computing applications in the second half of 2025, with mass production starting in 2026. In the area of advanced packaging, TSMC aims to continue expanding production through 2028 and has increased orders for related equipment.