Samsung to Supply AMD Data Center FC-BGA

According to The Elec, Samsung Electro-Mechanics announced on Monday that it will supply high-performance chip boards to AMD for hyperscale data centers, confirming the deal for the first time.

Reports had suggested that Samsung Electro-Mechanics has been supplying server Flip-Chip Ball Grid Array (FC-BGA) boards to AMD since 2022. These boards are likely produced at Samsung's facilities in Busan, South Korea, and Vietnam.

Hyperscale data centers, defined by having over 100,000 servers running on ultra-high-speed networks, are experiencing increasing demand due to the rise of artificial intelligence and cloud services. Samsung's high-performance FC-BGA boards are essential for these advanced data centers.

Samsung Electro-Mechanics' and AMD's data center boards are ten times larger and three times thicker than traditional FC-BGA boards, designed to accommodate CPUs and GPUs. Samsung has resolved warpage issues, ensuring high yields during chip installation on the circuit boards.

Entering the server FC-BGA market, Samsung Electro-Mechanics is set to compete with established Japanese players Ibiden and Shinko Denki. Intel had secured multi-billion-dollar deals with Ibiden and Shinko Denki in the early 2020s, which posed supply chain challenges for AMD. This partnership with Samsung Electro-Mechanics helps AMD strengthen its position in the server CPU market and better compete with Intel.