TSMC's A14 Process Risk Production Set for Early 2026

According to sources familiar with TSMC's High-NA EUV roadmap, TSMC's A14 process (1.4nm) is scheduled for risk production in the first half of 2026, with mass production expected to start as early as Q3 2027. Initially, production will utilize ASML's third-generation standard EUV equipment, the NXE:3800E. By 2028, the enhanced A14P process will fully adopt High-NA EUV technology, including the EXE:5000 and EXE:5200 models. High-NA EUV will be fully integrated into the A10 process by 2030.

In May 2024, TSMC Chairman CC Wei and the executive team visited ASML's headquarters in the Netherlands to gain a comprehensive understanding of High-NA EUV systems, which are priced at $380 million each. During the visit, the TSMC team also engaged with several supply chain partners to discuss maintenance and component supply.

TSMC remains the leading player in the wafer foundry sector and is ASML's largest customer for EUV equipment. Reports suggest that TSMC's 3nm chip production is currently at full capacity, with a growing number of orders for the 2nm process, which is expected to enter mass production in Q4 2024. It is anticipated that TSMC's current EUV orders will reach around 70 units.

Additionally, TSMC and ASML have agreed on equipment purchase discounts and have established plans for process and technology advancements over the next five years.

On a similar note, Intel continues to push forward with its advanced manufacturing processes. In April 2024, Intel announced that its foundry division, Intel Foundry Services, completed the assembly of the industry’s first High-NA EUV lithography tool at its Hillsboro, Oregon R&D campus. This equipment will undergo multiple calibrations before entering volume production in 2027, supporting Intel's 14A process.