SK Hynix to Lauch Next-Gen HBM Standard with 30x Boost

At the SK Icheon Forum 2024, SK Hynix's Vice President Ryu Seong-su revealed the company's plans to develop a revolutionary High Bandwidth Memory (HBM) standard, promising up to 30 times the performance of current HBM products. This ambitious initiative aims to secure a competitive edge in the rapidly evolving HBM market.

"Our goal is to create a product with performance levels 20 to 30 times greater than today's HBM offerings, focusing on introducing highly differentiated solutions," stated Ryu Seong-su. Specific details about whether this next-generation HBM will be designated HBM4 or its comparison to existing HBM models were not disclosed.

SK Hynix is positioning itself to lead the HBM sector by integrating cutting-edge technologies into its products. The forthcoming HBM4 standard will integrate logic and memory semiconductors within a single package, setting new industry standards for performance and innovation.

In addition to these developments, SK Hynix has attracted significant interest from leading technology companies in the AI sector, including Apple, Microsoft, Google Alphabet, and NVIDIA. The company is addressing these firms' specialized engineering needs to maintain its leadership in the market.

SK Hynix is also exploring future expansion opportunities, including the potential development of proprietary storage semiconductors. Both SK Hynix and Samsung are expected to release their HBM4 products by mid to late 2025, aligning with upcoming next-generation platforms such as NVIDIA’s Robin architecture.

This announcement marks a significant milestone in the HBM industry, highlighting SK Hynix's strategic advancements and innovations that will shape the future of high-performance memory solutions.