Part #/ Keyword
All Products

Dimensity 9400 GPU Outperforms Rivals by 30%

2024-08-27 17:23:17Mr.Ming
twitter photos
twitter photos
twitter photos
Dimensity 9400 GPU Outperforms Rivals by 30%

MediaTek is set to unveil its next-generation flagship mobile platform, the Dimensity 9400, by the end of this year. This new SoC is expected to offer significant improvements in both performance and energy efficiency, with notable advancements in GPU capabilities and ray tracing performance.

Recent leaks indicate that the Dimensity 9400 will outperform competitors by 30% in GPU performance according to 3D Mark benchmarks, while achieving approximately 40% lower power consumption for similar scores. This combination of "powerful performance and efficient power usage" is poised to set a new standard in flagship GPU performance.

Moreover, the Dimensity 9400 is reported to deliver a nearly 20% improvement in ray tracing performance over its predecessor. It will also introduce a new ray tracing technology for mobile platforms, comparable to the high-end ray tracing technology found in PCs, known as OMM (Optical Ray Accelerator). This advancement promises to elevate ray tracing visuals to a new level.

In addition to GPU upgrades, the Dimensity 9400 will feature substantial enhancements in CPU and memory performance. The chips single-core CPU performance is expected to increase by over 30% compared to the previous generation, requiring only 30% of the power of rival products in similar scenarios. This balanced approach to performance and power efficiency is a key highlight.

In July of this year, MediaTek and Samsung successfully validated the next-generation Dimensity 9400 platform with the fastest 10.7Gbps LPDDR5X DRAM, establishing it as the fastest mobile memory available globally.

The Dimensity 9400 chip is anticipated to lead the mobile SoC CPU performance rankings. With "the worlds fastest" LPDDR5X memory and increased cache size, it is expected to provide top-tier performance for mobile devices without compromise.

Reportedly, the Dimensity 9400 will be manufactured using TSMC's second-generation 3nm process and will feature Armv9's Blackhawk architecture, combined with MediaTek's exclusive big-core architecture. This combination is expected to deliver substantial gains in both performance and energy efficiency. Additionally, the chip will further enhance generative AI capabilities, offering advancements across imaging, gaming, energy efficiency, and AI functionalities. The Dimensity 9400 is set to provide consumers with a groundbreaking experience in smart devices.

* Solemnly declare: The copyright of this article belongs to the original author. The reprinted article is only for the purpose of disseminating more information. If the author's information is marked incorrectly, please contact us to modify or delete it as soon as possible. Thank you for your attention!