Google Tensor G6 to Feature TSMC 2nm Technology

Industry sources reveal that Google plans to transition its chip manufacturing from Samsung to TSMC in 2025. The upcoming Tensor G5 and G6 processors will leverage TSMC's advanced 3nm and 2nm process technologies, respectively.

The Tensor G4 chip, used in Google's Pixel 8, is built using Samsung's 4nm process, offering only a slight upgrade over its predecessor, the Tensor G3. The G4 still employs Samsung's older FOWLP (fan-out wafer-level packaging) technology, rather than the newer FOPLP (fan-out panel-level packaging) technique. Notably, FOWLP has been effective in addressing overheating issues seen in the Exynos 2400 chip.

Looking ahead, Google's Tensor G5, which will power the Pixel 10, will be manufactured using TSMC's cutting-edge 3nm process and incorporate TSMC's advanced InFO-POP packaging technology. The Tensor G6, set to be featured in the Pixel 11 series, will also be produced by TSMC using their latest 2nm process.

In related news, Apple previously disclosed that two of its AI models, powered by Apple Intelligence, were trained using Google's Tensor Processing Units (TPUs) in the cloud. Additionally, Google's ARM-based TPU v5p "Axion," designed for data centers, is being produced using TSMC's 3nm N3E process.