MediaTek Dimensity 9500 to Use TSMC 2nm Process

Synopsys, a leading provider in electronic design automation (EDA) and semiconductor IP, recently announced that MediaTek will leverage its AI-driven EDA process for designing advanced chips at the 2nm process node.

Over the past two years, MediaTek has narrowed the gap between its flagship Dimensity mobile platform and Qualcomm's Snapdragon flagship by continuously innovating its “big-core” architecture, adopting the latest process technologies, advancing IP, and optimizing generative AI for edge applications. MediaTek's latest 3nm Dimensity 9400 chipset has already been adopted by several flagship smartphones, launching ahead of Qualcomm's Snapdragon 8 Ultimate.

Synopsys has also deepened its collaboration with TSMC, utilizing TSMC's cutting-edge process and 3DFabric technology to offer advanced EDA and IP solutions that accelerate innovation in AI and multi-die designs. The expanded partnership with MediaTek enables designers to develop high-performance analog silicon chips on TSMC's 2nm process, meeting demands for efficiency and optimized silicon design.

Commenting on the collaboration, MediaTek Vice President Dr. Tsai Lee-Chen emphasized that working with Synopsys unlocks the full potential of AI-driven processes, accelerating design migration and optimization. This, he noted, further supports MediaTek's efforts to lead in system-on-chip (SoC) advancements across diverse markets.

TSMC's Ecosystem and Alliance Director, Dan Kochpatcharin, praised the collaboration, stating that Synopsys' AI-driven EDA suites and silicon-certified IP have significantly enhanced productivity for clients and delivered remarkable advancements for AI chip design.

TSMC is on track for mass production of its 2nm process by 2025. In a recent earnings call, TSMC reported that development of its 2nm technology is progressing well, with device performance and yield rates meeting or exceeding expectations. The company anticipates that the number of 2nm product tape-outs within the first two years will surpass that of both 3nm and 5nm processes.

Looking ahead, MediaTek's next-generation Dimensity flagship mobile chipset, the Dimensity 9500, is expected to be one of the first to utilize TSMC's 2nm process. Industry observers are optimistic about MediaTek's growing influence in the AI sector, an area where MediaTek CEO Rick Tsai previously noted the importance of edge computing and cloud computing. Tsai emphasized that to lower total cost of ownership (TCO), data center operators are increasingly turning to custom chip solutions, a demand MediaTek aims to meet through its flexible ASIC business model.