AMD Rumored to Launch Mobile APUs with TSMC 3nm

Recent industry reports suggest that AMD, a leading processor manufacturer, is exploring entry into the mobile chipset market. It is anticipated that the new products will be manufactured using TSMC's advanced 3nm process technology. This move is expected to sustain TSMC's 3nm production capacity at peak levels, with visibility on orders extending into the second half of 2026.

Neither AMD nor TSMC has commented on these reports, declining to address market rumors or disclose specific customer collaborations. However, industry speculation indicates that AMD is developing a mobile APU (accelerated processing unit) designed for mobile devices, leveraging TSMC's 3nm process. This strategy aims to extend AMD's presence in mobile computing, particularly in high-performance segments.

Previously, AMD collaborated with Samsung on the Exynos 2200, integrating AMD's RDNA 2 architecture into Samsung's Xclipse GPU to enable advanced features like ray tracing for enhanced graphics processing. However, this partnership did not involve AMD's core mobile chipsets. Analysts believe that given AMD's prior collaboration with Samsung, the forthcoming APU could debut in Samsung's flagship devices. If realized, this would mark another instance of TSMC-produced chips being incorporated into Samsung's premium smartphones, reminiscent of the Qualcomm processors in earlier Galaxy S-series models.

Market observers are optimistic about AMD’s ongoing partnership with TSMC, forecasting AMD to remain one of TSMC’s top three customers this year. This collaboration extends to advanced packaging technologies, as demonstrated by the AMD MI300 series. These APUs, which combine 5nm and 3nm technologies on TSMC's 3DFabric platform, integrate GPUs and CPUs using SoIC-X stacking and CoWoS packaging for groundbreaking computational performance.

According to a recent report from TrendForce, TSMC's 3nm process is gaining traction among major clients, including Apple, AMD, MediaTek, and Qualcomm, with order visibility now extending into 2026. Despite a threefold increase in 3nm production capacity this year, demand continues to outstrip supply, prompting TSMC to adopt measures to further expand its production capabilities and accelerate capacity ramp-up.

The TSMC 3nm family includes technologies such as N3, N3E, N3P, N3X, and N3A. The N3E node, which began production in late 2023, targets applications in AI accelerators, high-end smartphones, and data centers. N3P is scheduled for production in late 2024, with projected adoption in mobile devices, consumer electronics, and base stations by 2026. Meanwhile, N3X and N3A are being developed for specialized applications in high-performance computing and automotive sectors, respectively.