AMD Patent on Glass Substrate, 2026 Launch Planned
According to a report from Tom's Hardware, AMD has recently secured a patent for a glass-core substrate technology (Patent No. "12080632"). This development reflects the company's ongoing efforts to explore glass-core substrates, which will play a key role in its plans to adopt glass substrates for ultra-high-performance system-in-package (SiP) solutions by 2026. The technology also helps AMD mitigate potential patent-related risks in the future.
Compared to the industry-standard organic substrates, glass-core substrates offer superior thermal and mechanical properties. The coefficient of thermal expansion (CTE) of glass is close to that of silicon, which can be adjusted according to specific customer designs. This enables the support of advanced integrated power delivery at higher temperatures. Glass also provides excellent rigidity, making it less prone to deformation. It enhances dimensional stability, reduces warping during manufacturing processes, and supports better feature scaling. Additionally, glass's ultra-smooth surface quality is ideal for producing more precise wiring layers.
One of the standout features of glass substrates is their exceptional electrical isolation. With adjustable dielectric properties, they prevent interference between electrical signals, offering a remarkable 10x improvement in via density. Glass substrates also support larger form factors than traditional 12-inch silicon wafers, enabling circuit boards up to 240mm x 240mm in size. Furthermore, the high transparency of glass paves the way for future optical signal integration and high-speed data transmission, making it a crucial technology for high-performance computing chip companies such as AMD, Intel, and NVIDIA.
A key challenge outlined in AMD's patent involves the creation of Through Glass Vias (TGVs). TGVs are vertical channels within the glass core that facilitate data signal and power transmission. Currently, techniques such as laser drilling, wet etching, and magnetic self-assembly are used to create these vias.
Another essential component of advanced chip packaging is the redistribution layer (RDL), which routes signals and power between the chip and external components. Unlike traditional glass-core substrates, these RDLs will continue to use organic dielectric materials and copper, but will be constructed on one side of the glass substrate, requiring a new manufacturing approach.
AMD's patent also details a method for bonding multiple glass substrates using copper-based bonding instead of traditional solder bumps. This approach ensures strong, gap-free connections, improving reliability and eliminating the need for bottom-filling materials, making it suitable for stacking multiple substrates.
The glass-core substrates offer significant advantages in thermal management, mechanical strength, and enhanced signal routing capabilities—all of which are critical requirements for data center processors.
Several industry players are also actively pursuing glass-core substrate technology. Intel plans to begin mass production of glass substrates by 2026, while Samsung aims to complete prototype technology by next year, with mass production slated for 2026. LG Innotek has established a dedicated department this year to prepare for entry into the glass-core substrate market. SKC, a chemical materials subsidiary of South Korea's SK Group, recently announced the completion of its chip-focused glass-core substrate plant in Covington, Georgia, in July, and is already producing prototype products. AMD plans to integrate glass-core substrates into its chips for ultra-high-performance SiP solutions between 2025 and 2026.
