REDMI & MediaTek Unveil Turbo 4 with Dimensity 8400-Ultra Chip

On the afternoon of January 2, the REDMI Turbo 4 smartphone was officially unveiled, becoming the first globally to feature the MediaTek Dimensity 8400-Ultra flagship chipset. Combining flagship-level performance with exceptional energy efficiency, this device is poised to redefine expectations for mid-to-high-end smartphones.

In a strategic collaboration, REDMI, MediaTek, and Arm have come together to launch a customized Dimensity 8400-Ultra platform. The upgraded full big-core architecture of this chipset delivers extraordinary power efficiency, reshaping the performance landscape for smartphones in this segment.

Thanks to this powerful partnership, the REDMI Turbo 4 and Dimensity 8400-Ultra are set to elevate the consumer experience with light flagship smartphones. The introduction of the full big-core architecture ensures that more users can now enjoy a high-performance, energy-efficient smartphone experience.

With the continued advancements of generative AI, 5G, and other technologies, the global smartphone market is entering a new phase of development, driving ongoing innovations in mobile chip architectures. The Dimensity 8400-Ultra not only marks the debut of the full big-core architecture but also includes a host of innovations in CPU, GPU, NPU, imaging, and communication technologies. This makes the Dimensity 8400-Ultra one of the most powerful and well-equipped light flagship platforms MediaTek has ever produced.

The Dimensity 8400-Ultra is positioned as a "full big-core energy-efficient chip" and represents a monumental upgrade within the Dimensity 8 series. Built on a 4nm process, this chip introduces the new generation Arm Cortex-A725 big core, flagship-level L2/L3/SLC cache, and the latest GPU, NPU, and ISP architectures. It ensures seamless gaming experiences, maintaining high frame rates in mainstream and heavy-load games, while providing smooth performance across 10 major high-frequency daily use scenarios.

Key specifications of the Dimensity 8400-Ultra chipset include an eight-core CPU design with up to 3.25GHz clock speeds on the Arm Cortex-A725 big cores. The CPU features a "1x 3.25GHz + 3x 3.0GHz + 4x 2.1GHz" configuration, providing a 10% increase in single-core performance and a 35% reduction in power consumption compared to the previous generation. Multi-core performance sees a significant 41% improvement, with a 44% decrease in power consumption, making the device highly efficient across a variety of use cases, including gaming, music, video recording, and social interactions.

The chipset is also equipped with the Mali-G720 MC7 GPU, which boasts a 24% increase in peak performance and a 42% reduction in power consumption compared to the previous model. This GPU supports hardware-based ray tracing and optimizes touch latency, providing users with a richer, more immersive visual experience, while easily handling complex gaming scenes and high frame rate requirements.

In addition to the powerful Dimensity 8400-Ultra chipset, the REDMI Turbo 4 features a host of advanced hardware specifications, including a 3D Ice Seal Cooling Pump, a 1.5K high-brightness display, a 6550mAh Xiaomi Jinsha River battery, upgraded dual-boost cold-resistant chips, a 2.5D micro-arc frame, a matte frosted glass back cover, and IP68-level dust and water resistance. These features combine to create a smartphone that excels in both performance and user experience.