Micron Begins $7B HBM Packaging Facility in Singapore

According to reports, Micron Technology has officially broken ground on a $7 billion High Bandwidth Memory (HBM) packaging facility in Singapore, located next to its existing DRAM wafer plant. The new facility is set to begin operations in 2026, with plans to significantly expand its advanced packaging capacity by 2027 to meet the growing demands of AI technologies. Micron's investment is expected to be fully realized by 2030.

Initially, the project will create approximately 1,400 jobs, with workforce numbers expected to grow to around 3,000 as the facility expands. These positions will focus on packaging development, assembly, and testing operations.

"This is Singapore's first advanced HBM packaging facility, enabling us to contribute to the global growth of artificial intelligence," said Png Cheong Boon, Chairman of the Singapore Economic Development Board, in a statement released by Micron.

In addition to the HBM facility, Micron's Singapore plans include long-term support for NAND Flash manufacturing, further strengthening its presence in the region and its role in advancing next-generation memory solutions.